   No solder paste is used, no conductive adhesive is used, and the LED chip is bonded with insulating glue, and the LED light is brighter. Recently, Chen Jianwei, general manager of a company presented their latest patent to the author, then led chip with an insulating adhesive.
Chen Jianwei introduced that when the LED package is bonded to the vertical flip chip, the traditional process is to fix the chip on the circuit board by means of conductive silicate, silver glue or gold-tin alloy eutectic soldering. This process not only has high bonding material cost, but also The requirements for the equipment used are also high. However, no one has ever changed this process because in the inherent concept, the bonding between the board metals can only be done with conductive materials. In fact, in other words, if the surface of the metal electrode pad of the electronic circuit board is optimized to a rough surface, the rough surface or the point formed by the rough surface is in contact with the LED flip chip metal electrode having a relatively small average roughness. Conduction has been achieved, and the next step is to fill the gap between the two metals with an adhesive, which is the best filler.
According to this technical route, Chen Jianwei improved the performance of the adhesive and innovated in the bonding technology. He realized the first innovation of bonding LED chips with insulating glue and applied for a patent. With this method, the bonding cost is one tenth of the original, and the required equipment is simple. Moreover, the pitch after bonding is small, the LED volume is reduced, and the transparency is improved, so that the LED luminous efficiency is higher and brighter. Experts said that this technology promotion can bring huge benefits to the led industry .
LED business network focuses on led e-commerce platform, promote led enterprises to achieve Internet + , official website: http://Xinxiang Mina Import & Export Co., Ltd. , https://www.mina-motor.cn