At the same time, in terms of new product development, the company will continue to introduce new products and increase sales. For example, the newly introduced ceramic substrate COB products have good electrical insulation ability, good thermal conductivity and high profit margin. "The overall trend of the market in the second half of the year should be good." Gao Jiwei said confidently.
In addition to super bright white LED products in the domestic high-end users have a large market share, Hangke Optoelectronics has accumulated many years in the LED module.
"LED modules need to be matched with downstream applications, and generally need to be tailored to the specific requirements of customers. At present, there is no uniform standard for interfaces or specifications." Gao Kewei said that Hangke Optoelectronics has been promoting and expecting the industry to establish a Uniform standards, but the conditions under the current market conditions are still immature. He revealed that the company is currently cooperating with several major customers to carry out special module customization, so that it can make some optimizations on common products, fully demonstrate the product advantages of Hangke Optoelectronics, and achieve full docking with customer needs.
In the past two years, “vertical integration†has frequently appeared in the development strategy of LED industry enterprises. The vertical integration of packaged enterprises is to reduce costs and control the quality of each link. This has high requirements for capital and management. Gao Jiwei said that the challenge lies in management and technology.
Regardless of whether the enterprise was originally a chip or a package, vertical integration will be extended to the downstream and extended to areas that it was not good at. It needs to face different sub-disciplinary areas, and the teams and products to be managed are different. There is still a problem of cultural integration in the acquisition. Gao Jiwei said that Hangke Optoelectronics has been focusing on the packaging field that it is good at. At the same time, it maintains a model of cooperation with upstream chip factories and provides LED module products downstream. “As part of our long-term strategy, we will strengthen our research and development in key raw materials for packaging.â€
Gao Jiwei revealed that Hangke Optoelectronics will unveil its 135-square-meter special booth at the 2012 Hi-Tech LED Exhibition, which will open on August 17th. It will showcase new particle LED light source products and LED module products with overall solutions, including Ceramic substrate surface light source, new module for street lamps, etc.
2012 High-tech LED Exhibition Exhibition Address: Guangzhou Poly World Trade Center Expo Booth No.: P05
Exhibition date: August 17-19, 2012
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