The power consumption of human beings for lighting accounts for about 20% of the total electricity consumption in the world. Therefore, how to save electricity for lighting has become a serious concern of governments, the scientific and technological circles and industry in the world.
High-brightness light-emitting diodes (LEDs) are becoming a new generation of light sources for upgrading the traditional lighting industry because of their low power consumption, long life, fast response, no stroboscopic, small size, no pollution, and easy integration. Today, with the theme of energy conservation, emission reduction and environmental protection, semiconductor lighting has become a new economic growth point. Therefore, it has been highly valued by governments, science and technology and industry around the world. So far, the United States, Japan, Europe, China and China Taiwan and other companies have launched their own semiconductor lighting plans. The high-power LED lighting industry has become one of the most watched industries. In the future, it is likely to develop into a large industry with a scale of over US$100 million. A revolution in the lighting industry has quietly advent.
A noteworthy objective fact is that the upstream epitaxial chip technology has basically matured and shaped, and the cheap and good chips have been able to meet the lighting demand. Now the pricing power is shifting and developing in the midstream packaging and downstream application terminal market. This means that who can apply the chip to create long-life, high-efficiency high-power LED lighting, who is likely to become the ultimate winner of the LED industry. The problems of high-power LED lighting package and application are highlighted. The most critical issue is how to solve the heat dissipation problem of high-power LED lighting. This is not only a technical problem such as structural design and engineering application, but also a thermal management mode. And scientific issues such as fluid mechanics.
This paper aims to analyze the current status of high-power LED lighting technology "chip-aluminum substrate-heater three-layer structure mode", and propose a new technical route for high-power LED lighting. On this basis, a brief introduction to "chip-heat dissipation" The integrated (two-layer structure) mode technology, in turn, gives the choice direction of the (integrated) high-power LED lighting technology route.
For more information, please refer to the March issue of "High-tech LED-Technology and Applications" magazine
Also known as R134a gas. Under normal temperature for the odorless and colorless gas. Boiling point -26.5 ° C, the freezing point -101 ° C 1.202g/cm3 liquid density. Critical temperature 100.6 ° C Critical pressure 40.03 × 105. Low toxicity, and flame resistant, low chemical reactivity and high stability. PCE fluoride can be obtained CFC-113, via isomerization, fluoride and hydrogen obtained; PCE or fluorinated obtained HCFC-123 and then by fluoride and hydrogen obtained; TCE also as the raw material, fluoride in HCFC-133a, and fluoride system in the product. In refrigeration systems, medical and certain spray foam application is CFC-12 is the preferred alternative.
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