Do you know these six filament lamp related patents?

Jingyuan Optoelectronics (Crystal Power) filed a patent infringement lawsuit against Adamax (selling under the Newhouse Lighting brand) at the Northern California District Court in the United States on 8/30/2016.

In the complaint, Jingdian pointed out that Newhouse Lighting products infringed six crystal patents and applied for an injunction to prohibit Adamax from continuing to sell infringing New house Lighting products.

In the complaint, Jingdian pointed out New House Lighting filament bulbs, for example, dimmable candle-type 3.5-watt LED retro-style Edison filament lamps, infringing a number of US patents for crystal power, including: US6346771, US7489068, US7560738, US8240881, US8791467, US9065022 .

The following six patents are introduced one by one:

1US6346771

The patent was filed on November 19, 1998 by UnisplayS.A., Switzerland, and was granted an invention patent on February 12, 2002. On December 2, 2011, the patent was transferred to Jingdian.

The main claim of the patent:

The LED chip has a non-semiconductor, transparent substrate, and the chip N electrode has a branched electrode pattern.

This patent summarizes abstractly the characteristics of sapphire substrate LED chips.

This patent application in 1998 almost predictively describes the technical characteristics of mainstream LED chips (sapphire substrate LEDs) in the market after more than 10 years.

Crystal Electric bought this patent, which is quite lethal for the patent litigation of sapphire substrate LED chips.

2US7489068

The patent was applied for by Jingdian on January 6, 2006, and was granted an invention patent on February 10, 2009.

The main claim of the patent:

A LED chip that crystallizes a transparent substrate.

The patent document writing technique is fully utilized, and the protection range is extended from the chip transparent substrate to the chip + transparent substrate, and the "transparent substrate" feature of the filament package is directly cut.

3US7560738

The patent was filed on March 11, 2005 by Jingdian and was granted an invention patent on July 14, 2009.

The main claim of the patent:

On the transparent substrate, a plurality of LED chips and metal wires are connected in series.

Directly cut the "multi-chip series" feature of the filament package.

4US8240881

The patent was applied for by Crystal Power on November 13, 2008, and was granted an invention patent on August 14, 2012.

The main claim of the patent:

The LED chip is packaged on a transparent substrate to cut the "transparent substrate" feature of the filament package.

This is almost a patent for "unintentional Liu, Liu Chengyin". The original technical solution of the patent is that the chip is first packaged onto a transparent substrate and then placed in a package holder. The program itself has been proved by historical development that there is no application prospect, but the "LED chip packaged on the transparent substrate" is hit by the filament package.

When the patent is laid out, many patented technical solutions seem to have no practical significance, but a small technical point scattered in these patents may become a litigation weapon inserted in the direction of technology development.

5US8791467

The patent was applied for by Jingdian on May 11, 2011, and was granted an invention patent on July 29, 2014.

The main claim of the patent:

The LED chip is bonded to a highly thermally conductive substrate.

Although the technical solution of the patent itself is for the red chip to change the substrate, here "the chip is stuck to a high thermal conductive substrate" is one of the characteristics of the filament package.

Jingdian is very skilled in using the method of “patent layout + patent document writing to expand the scope” to form a patent protection network.

6US9065022

The patent was filed by Crystal Power on March 18, 2013 and was granted an invention patent on June 23, 2016.

The main claim of the patent:

Use a LED filament source to achieve a high-angle bulb.

In 2013, filament lamps have been widely concerned, and many manufacturers have been investigating how to use filaments to achieve high-angle bulbs, but they have not applied for a US patent.

Jingdian has sharply captured the market prospects and laid out the patents for downstream applications as an upstream chip manufacturer.

In recent years, in the industrial background of the price and profit of LED lighting products, the filament lamp can be described as a prominent and popular. In the past, the threshold of filament lamps was in process and yield. Today, Crystal Electric has also moved the patented threshold for filament packaging.

Through comprehensive application of various patent layout methods, Jingdian has realized a comprehensive patent layout of filament packaging.

1. Purchase a basic patent with a very early application date.

2. Form a patent protection network by using the method of “patent layout for technology points + patent document writing to expand the scope”.

3. Keep an eye on the market and the patent layout covers the industrial chain.

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