The research team of Fuji Electric and Yamanashi University developed a small and lightweight direct water-cooled vehicle-mounted IGBT module, and was held at the International Conference on Power Semiconductors "ISPSD 2013" (May 26-30, 2013 in Kanazawa City, Ishikawa Prefecture, Japan , Sponsored by the Japan Electrical Society) published the technology used in the module. The voltage resistance of the module is 1200V, the current is 500A, and the area is 320mm & TImes; 170mm. According to reports, overseas, the module has been used in hybrid vehicles (HEV) launched at the end of 2012, while in Japan, it will be equipped with HEVs scheduled to be launched in June 2013.
In the original water-cooled IGBT module, the IGBT chip was packaged on a ceramic substrate, a metal plate named "Base Plate" was placed under the substrate, and then a heat sink was placed under the metal plate. The direct water-cooled IGBT module eliminates the Base Plate, configures the ceramic substrate with IGBT chips on the heat sink, and uses water to cool the heat sink.
Other companies have also developed direct water-cooled IGBT modules for in-vehicle applications, but the characteristics of this development are that the ceramic substrate uses Al2O3 and the heat sink uses aluminum. Most of the competitive products are Si3N4 for ceramic substrates and copper for heat sinks, or Al2O3 for ceramic substrates and copper for heat sinks.
The main purpose of using Al2O3 this time is to reduce the thermal resistance and make the IGBT module smaller. Although the thermal conductivity of Al2O3 is lower than that of Si3N4, the stress resistance is strong and it is easy to thin, so the thermal resistance can be reduced. In addition, when Al2O3 is used for the ceramic substrate, the copper wiring packaged on the substrate can be thickened, which can further reduce the thermal resistance. With these means, compared with the original water-cooled type, this direct water-cooled module reduces the thermal resistance by about 30%.
The use of aluminum for heat sinks is mainly for light weight. However, the thermal expansion coefficients of Al2O3 and aluminum are quite different, and the stress during thermal cycling will increase. Therefore, this time improved the solder material when welding Al2O3 and aluminum.
The module uses tin-antimony (Sn-Sb) solder. The research team used four types (Type 1 to 4) of tin-antimony solder with different composition ratios to investigate the state of solder cracks during heating cycles. "Type 3", which is easy to use in the manufacturing process, did not show cracks after 2000 heat cycle tests in the temperature range of -40 ° C to + 105 ° C.
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