Puri Optoelectronics' new LED array improves COB architecture cost and then drops

Brian Fisher, director of marketing for Puri Optoelectronics, said that the company's Vero will completely overturn the LED array products on the market and help customers develop more cost-effective LED lighting solutions.

Brian Fisher, director of marketing for Puri Optoelectronics, said that compared to the previous generation of LED arrays, Puri Opto's Vero series products use a redesigned COB packaging technology architecture to help increase the lumen density of LED arrays to reduce the unit price per lumen of LED arrays; It can also improve the optical fill and thermal inconsistency of each LED chip to simplify the selection of LED driver ICs; while improving optical control and narrow beam (Narrow Beam) optics, it is better to design a more compact And more sophisticated light sources.

Fisher pointed out that compared to the market's LED array products, the Vero series offers significantly more lumens than the same source size, color temperature and color rendering, especially for retail and street lighting applications. The large-size LED array has a lumen difference of up to eight times. The Vero series has a luminous efficiency of 110 lumens per watt, a color temperature of up to 3,000K, a color rendering (CRI) of up to 80 and a maximum lumen count of up to 16,300 lumens.

On the other hand, Purui Optoelectronics also integrates more optical components into the LED array through system-in-package (SiP) technology to assist LED lighting customers in mass production of more cost-competitive solutions. Fisher stressed that the price of LED lamps is comparable to traditional light sources, and LED array packaging and lighting system design are two key. From the perspective of the cost of LED lamps, LED light sources only account for 25 to 30% of the total cost. It is obvious that the cost of LED light sources has not determined the maximum price of lamps. How to reduce the unit price of other components is also crucial.

Unlike previous generation LED arrays and competitors, Vero uses SiP technology to integrate optical and functional components such as two-dimensional (2D) bar code, pad (Solder Pad), and optical positioning (Optic Locating) functions into LED arrays. Significantly reduce the cost of developing, manufacturing and assembling other optical and functional components. Fisher said that in the future, the company plans to integrate wireless technology, production history, sensors and other functions in LED arrays to further realize smart light sources.

Fisher further revealed that the company's GaN-on-Si LED chips will be mass-produced in the first half of 2013. Once bismuth-based GaN LEDs are used, LED arrays will be easier to integrate through SiP technology. Versatile, more responsive to market trends that integrate more features and components into a single LED array platform.