Analysis of the development trend of LED high power packaging

Since 2012, the future of the LED industry seems to be not bright. Recently, after several billion-dollar LED companies collapsed, on August 20th, Shenzhen Leixing Photoelectric Co., Ltd. was closed down and dissolved a week ago. In the LED industry's "closing tide" flooding into the small and medium-sized enterprises, what is the current status and development trend of LED high-power packaging?
COB packaging has become mainstream
For the market development of LED packaging, the development of upstream high-power enterprises can make the LED industry 'all lively', and even fundamentally change the industrial pattern of China's LED.
LED high-power packaging As early as 2005, foreign giants were already developing and producing, but the technology at that time was not very mature. The time when the LED high-power package really matured was in 2010, and at this time, Huagao also started to develop and produce this piece. In terms of the technical level of the COB alone, it contains the circuit and the control driver chip.
Many people know that LED high-power packaging technology has matured in 2010, but it has not played a big role in the market. This is mainly due to the influence of heat (ie junction temperature), which affects the junction temperature, including packaging structure, packaging process, stability of core materials, chips, phosphors, glue and other raw materials. Over time, technology is also advancing with the times. The development of packaging technology in recent years can be included in four points:
First, the reform of the package structure. Mainly due to the heat dissipation reform, the chip is directly packaged on the substrate to reduce the thermal resistance.
Second, the technical reform of the chip. Not only is the improvement in light efficiency, but also thermal stability.
Third, the chip technology is fully mature. After several years of rapid development, the small chip technology has been fully mature, and the price has not dropped.
Fourth, the overall decline in the cost of LED packaging, this is also the most important point. The overall cost of LED packaging, from chips, phosphors, glue, to packaging materials, substrate and other related materials, coupled with the maturity of the package itself, so the overall price is so low that the high-power chip is completely the same as the low-power chip. Market competitiveness.
The development of COB packaging technology is of great significance in terms of application, because it can not only improve the effect of local lighting, but also can simplify the production line process in downstream lighting applications. Once the production line process is streamlined, companies can greatly reduce labor costs and increase production capacity efficiency. At the same time, the development of COB packaging technology has also improved its overall performance, and its illumination angle, spot, light softness and stability can be improved. The price advantage of COB package products is outstanding in the products of 7W or above. The advantages below 7W are not so obvious, but as their technology, process and materials continue to improve, their advantages will be reflected.
At present, there is another kind of flip chip technology in the trend of the domestic LED packaging industry. Flip-chip is also recognized as a technology with potential for development in the industry. Its package structure has greatly improved in terms of thermal resistance and light-emitting efficiency of the chip. But it has a fatal weakness - it is not compatible with existing gold wire bonding process equipment. If domestic enterprises want to do this technology, they need to re-invest in production line equipment, and the cost will be doubled. For SMEs, the investment is too large, and the current mainstream packaging technology in China is still fully adapted to market demand. Even the best technology, if it is not suitable for the mass market, it is difficult to have a large-scale popularity.

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