Yesterday, just after the introduction of the new SDHC card using the UHS-I standard, the SD Association has begun to plan next-generation interface standards. At the IFA Consumer Electronics Show in Berlin, Germany, the SD Association announced that the next-generation SD 4.0 standard will use a double-row pin design to increase the interface speed to 300 MB/s.
It is said that the newly added second row of pins will be used for high-speed connection, but the appearance and shape of the memory card will not change, ensuring backward compatibility. Both SDHC/SDXC cards and MicroSDHC/MicroSDXC cards can use this design to improve performance.
The double-row stitch design is part of the SD 4.0 standard, and the SD 4.0 labeling is expected to be officially announced early next year.
It is said that the newly added second row of pins will be used for high-speed connection, but the appearance and shape of the memory card will not change, ensuring backward compatibility. Both SDHC/SDXC cards and MicroSDHC/MicroSDXC cards can use this design to improve performance.
The double-row stitch design is part of the SD 4.0 standard, and the SD 4.0 labeling is expected to be officially announced early next year.
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