The heat dissipation manufacturer Hex Technology intends to apply the developed (high thermal conductivity substrate) ceramic direct copper clad board to the COB packaging process of the surface light source, which can easily solve the heat dissipation problem and effectively reduce the cost. At present, it has cooperated with several major manufacturers in Taiwan. It is expected to mass production in 2011.
The head of Hex said that the HCS high thermal conductivity substrate has excellent high thermal conductivity (24~170w/mK), high insulation performance (>14kv/mm), excellent solderability and high current. The load-bearing capacity, while the coefficient of thermal expansion is close to that of silicon, does not require molybdenum sheets, saves labor, saves materials, simplifies the Wire Bounding process, and can etch various line patterns like a PCB board, with the COB simple process of LED surface light source, It can effectively reduce the cost of LED packaging, and it is very competitive in the current situation of high LED prices.
At present, the monthly production capacity of HCS high thermal conductivity substrate is about 100,000 pieces. In 2011, the second production line will be expanded, and different size substrates will be launched according to market demand. Now it is favored by LED manufacturers CREE and several concentrating solar manufacturers. .
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